BGA Repair Machine (ZM-R5860)

ZM-R5860 BGA Repair machine repair computer

Main Features
1. Adopt liner slide which makes XYZ axis all can do high positioning accuracy and fast maneuverability.
2. PCL control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repairment need.
3. There are 3 independent heating areas, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power comsumption. Top heater can be adjusted freely; Second heater can be adjusted up and down.
The machine operations be runned by human machine interface- high definition touch screen (Taiwan)
4. Offer all kinds of hot-air nozzle, it can rotate 360° , with magnet, easy to install and change, and offer customized service.
5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ± 3 ° .
6. Use a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size.
7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly.
8 There is an alarming after desoldering & soldering, and it is settled alarming in advance.
9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens.
10. It can save many temperature parameters, easy to repair same chips. And can repair lead or lead free chips, can meet repairment of laptop, xbox360, mobile, ps3 and other components on the motherboard.