sell best!! ZM-R6810RBGA rework/repair machine(fixing xbpx,ps.game console motherboard chips)

Main Features
1.3 independentheaters. The 1st and 2nd hot-air heaterscan control multiple groups and segments temperature parameters.The 2nd heater can move up and down. The 3rd large area IRheater can preheat the PCB board fully to ensure nodeformation to the board. Temperature, time, slope,cooling, alarming all can be displayed on the touchscreen.
2. High-precision K-type thermocouple withclosed loop control, automatic temperature compensation system,combined with Panasonic PLC and highly sensitive temperature modulefor the precise temperature control, the temperature errorcontrolled within ± 2 degree, The external 4-5 sensors can detecttemperature precisely, analyze and calibrate the real temperaturecurve accurately.
3.V-groove PCB support, rapid positioning, convenience, accuracy,can fit for all kinds of PCB board.
4.Flexible and removable universal fixture has protective effectsand no damage to the PCB board, suitable for all kinds ofBGA repair.
5.The top heater device and mounting headare integrated design and ball screw drive. Z-axis movements arecontrolled by Panasonic servo system which can accurately controlthe site and hotspots,with different size alloy BGA nozzles, 360degree rotation, easy to install and replace, customized isavailable; Laser positioning function is optional.
6.High-definition CCD color optical vision system,splitting, amplification, micro-adjust and auto-focus; Withautomatic color resolution and brightness adjustment device; it canadjust the definition of the image manually;
7.Without changing magnification, the optical lens can be movedmanually left or right, back orforth freely. Iobserve allaspects of the BGA chip. It displays clearly. The X, Y axis and Rangle with micrometer adjust, precise positioning, alignmentaccuracy is within ± 0.01MM, 15 TFT LCD Monitor.
8. CE certification, with emergency switch andautomatic power-off protection device when emergency happens; Withprotective mesh to prevent components drop and human burned.
9. Mounting, welding and dewelding process are intelligentcontrolled and work automatically, BGA mounting positionis controlled accurately, after finishing desoldering and solderingwith a double over-temperature protection, there is alarming. Whentemperature goes out of control, the circuit w automatically poweroff.
10.It can save multiple groups profiles. You can analyze, set andcalibrate the temperature parameters curve on the screen at anytime. You can print, save and analyze the curve through the USBport without other external devices (such as computer).
11.powerful cross-flow fan to cool the PCB board automaticallyafter desoldering and soldering, it can prevent the deformation ofPCB board to ensure the welding effect.
12.human-machine interface, high-definition touch screen(Taiwan),PLC control, password protection and calibrate function, can savemultiple profiles, instant curve analysis function.
13.With Multifunctional and humanized operation interface, there is"set up Interface" and "operation interface" on the touch screen toprevent wrong operations and setting; Temperature parameter haspassword protection to stop arbitrary changes.
14.This machine is equipped with pressure and optical sensors. tocontrol the pressure in 3-10 grams and optical switches, so that itcan automatically recognize the suction chip and mounting height,to ensure not crush BGA chip

15:.It can repair Socket775 and double BGA / CGA / IC andvarious shielding devices, meet the requirement of lead-freeprocess.
ZM-R6810 specifications
1 Total Power6750W
2 Top heater 1200W
3 Bottom heater 2nd heater 1200W,3rd IR heater 4200W
4 power AC220V±10% 50/60Hz
5 Dimensions L900*W680*H900 mm
6  V-groove, PCB support can be adjusted in any direction withexternal universal fixture
7 Temperature control K-type thermocouple (Closed Loop), heatingindependently,  precision within ±2 degree
8 PCB size Max 390*450mm Min 25*20 mm
9 Servo Drive( Panasonic) Touch screen( Taiwan) Panasonic PLCHeating plate(Germany)
10 Cameramagnification 10x-100x
11 Optical system Japanese original high-definition CCD colorimaging system
12 BGA chip 1×1-80×80mm
13 Touch screen 7.0 Resolution 640x480, Panel Visa touch screen,external USB interface
14 External temperature sensor Four
15Placement Accuracy X, Y axis and the R angle with micrometeradjust, accuracy within ± 0.01MM
16 Net weight 85kg  103.5*93.**89CM package wooden box

17 before shipping, will take 4 hours shaking test